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Description and features

Vicura DICY 100S is a micronized grade of dicyandiamide containing 1.5%-1.6% anti-blocking agent to inhibit clumping and improve handling. It is primarily used as a curing agent for epoxy resins.

Due to its high melting point, Vicura DICY 100S does not melt during extrusion, ensuring it forms a homogeneous mixture with the epoxy resin on a molecular scale. As a result, Vicura DICY 100S is supplied with a low particle size, which helps maintain acceptable homogeneity during the extrusion process, provided the premixing is done correctly.

Furthermore, epoxy powder coatings cured with Vicura DICY 100S exhibit outstanding features, including excellent adhesion to metal, exceptional chemical and solvent resistance, and very high impact, abrasion, and scratch resistance. Additionally, its excellent dielectric properties make these coatings suitable for a wide range of electrical applications.

Availability

Europe and United States: Provided Vicuta DICY 100S is in stock in our local warehouses our lead time is about one week if delivered in 20 KG carton boxes.

We can also serve Canada, South America, South Africa, and other markets. Please contact our sales department for more details.

This substance (CAS: 461-58-5) has been registered (FULL) under
REACH (EC) 1907/2006.

Product Identification

CAS number461-58-5
EC number207-312-8
HS code2926 20

Specification

Appearance Fine white powder
Assay≥97.30 %
Particle size≥98.00 % <10 μm
Moisture≤0.50 %
Anti-caking agent≥1.60 %

Application

Vicura DICY 100S is being used in the production of: adhesives, (powder) coatings and (epoxy) resins.

Packaging

Available packaging: 20 KG carton boxes.
Special packaging is available on request.

Storage

Store dicyandiamide in a cool, dry and well-ventilated area and in line with legal requirements.

MSDS

A Material Safety Data Sheet (MSDS) is available for Vicura DICY 100S and all other products supplied by Vesta Chemicals BV.

An MSDS outlines the hazards of a product and explains how to handle, use, and store the product safely. Besides it provides important regulatory and emergency response information for the purchased product.

Molecular and structural information

Molecular formula C2H4N4
Molecular weight 84.08 g/mol
Smiles notation C(#N)N=C(N)N
InChi key QGBSISYHAICWAH-UHFFFAOYSA-N
Structural formula

Physicochemical information

Bulk density 1.404 g/cm3
Melting point ≥210 – ≦ 212 ºC
Partition coefficient (log Pow) 1.00 @ 20 ºC ± 0.50 ºC
Solubility in water 4.13 g/100 gram water @ 25 ºC