Description and features
A micronized grade of dicyandiamide containing 1.5%-1.6% anti-blocking agent to inhibit clumping and improve handling. It is used as curing agent for epoxy resins.
Due to its high melting point Vicura DICY 100S does not melt during extrusion to produce a homogeneous mixture with the epoxy resin on a molecular scale. Therefore Vicura DICY 100S is supplied with low particle size assuring in this way acceptable homogeneity during the extrusion step, provided the premixing process is done properly. Outstanding features of epoxy powder coatings cured with Vicura DICY100S include excellent adhesion to metal, excellent chemical and solvent resistance, very high impact, abrasion and scratchy resistance, and dielectric properties that make them suitable for many electrical applications.
Availability
Europe and United States: Provided Vicuta DICY 100S is on stock in our local warehouses our lead time is about one week if delivered in 20 KG carton boxes.
Canada, South America, South Africa and other markets can also be served, please contact our sales department for more details.
This substance (CAS: 461-58-5) has been registered (FULL) under
REACH (EC) 1907/2006.
Product Identification
| CAS number | 461-58-5 |
| EC number | 207-312-8 |
| HS code | 2926 20 |
Specification
| Appearance | Fine white powder |
| Assay | ≥97.30 % |
| Particle size | ≥98.00 % <10 μm |
| Moisture | ≤0.50 % |
| Anti-caking agent | ≥1.60 % |
Application
Vicura DICY 100S is being used in the production of: adhesives, (powder) coatings and (epoxy) resins.
Packaging
Available packaging: 20 KG carton boxes.
Special packaging is available on request.
Storage
Store dicyandiamide in a cool, dry and well-ventilated area and in line with legal requirements.
MSDS
A Material Safety Data Sheets (MSDS) is available for Vicura DICY 100S and all other products supplied by Vesta Chemicals BV.
An MSDS describes the hazards of a product and explains how a product can be safely handled, used and stored. Besides it provides important regulatory and emergency response information for the purchased product.
Molecular and structural information
| Molecular formula | C2H4N4 |
| Molecular weight | 84.08 g/mol |
| Smiles notation | C(#N)N=C(N)N |
| InChi key | QGBSISYHAICWAH-UHFFFAOYSA-N |
| Structural formula |  |
Physicochemical information
| Bulk density | 1.404 g/cm3 |
| Melting point | ≥210 – ≦ 212 ºC |
| Partition coefficient (log Pow) | 1.00 @ 20 ºC ± 0.50 ºC |
| Solubility in water | 4.13 g/100 gram water @ 25 ºC |